Printed Circuit Boards  

• 2 to 12 layers  ​​​​

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Flexible Printed Circuits 

• 2 to 12 layers ​

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Rigid Flex 

• 2 to 8 layers ​

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Flexible Heaters 

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Printed Circuit Board Assemblies 

• Manual Assemblies 

• Automated (SMT) Assemblies 

• Full Turnkey Assemblies 

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Utilizing Pentalogix-CamMaster software and Design Rule Checks (DRS’s) as well as Design for Manufacturability (DFM). 

• Data set issues reporting 

• Fast resolution of jobs that are placed “On-Hold”. 

• DRC’s and DFM on each design. 

• 274X / DXF / ODB++ input capabilities. 

• Impedance modeling and stackups performed using proven Polar Software tools. 

• Netlist Comparison. 

• 1- 20 Layers. 

• Blind & Buried Vias. 

• Via in Pad Technology Using conductive & non-conductive Fill materials (CB-100, San Ei PHP 900, etc.) 

• Automated Optical Inspection (AOI) for both inner and outer layers. 

• Controlled impedance, Plated Slots, Plated Edges, Selective Plating, Launch sites, Countersink / Counterbore, Score, Planar Transformers, Printed Antennas, and more. ​​​

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Trace/Space and Drilling 

• .003” line and space Capability (Film-less Direct Imaging in use). 

• Drilling with .008” bits for .006” hole size for .062” PCB’s 

• High Aspect Ratio of 10:1. 

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Board Finishes 

• Tin plating 

• 63/37 Solder 

• ENIG- Electroless Nickel Immersion Gold 

• Lead Free Solder 

• Immersion Silver 

• Electrolytic Hard or Soft Gold 30-100 microinches 

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Materials (RoHS Laminates) 

• Ventec VT-47 

• Ventec VT-461 

• Isola 185 HR 

• Isola 370 HR 

• Isola IS410 

• Isola FR408 

• Isola P95/P96 polyimides